GOTO, Toshiyoshi: search on Z-Library

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1

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Triple-Stacked Wafer-to-Wafer Hybrid Bonding for 3D Structured Image Sensors

Honda, Yuki, Goto, Masahide, Watabe, Toshihisa, Nanba, Masakazu, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Year:

2019

Language:

english

File:

PDF, 5.24 MB

english, 2019

2

Effect of crushing unhulled rice and the addition of fermented juice of epiphytic lactic acid bacteria on the fermentation quality of whole crop rice silage, and its digestibility and rumen fermentation status in sheep

Toshiyoshi TAKAHASHI, Ken-ichi HORIGUCHI, Masakazu GOTO

Journal:

Animal Science Journal

Year:

2005

Language:

english

File:

PDF, 83 KB

english, 2005

3

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers

Goto, Masahide, De Vos, Joeri, Watabe, Toshihisa, Hagiwara, Kei, Nanba, Masakazu, Iguchi, Yoshinori, Higurashi, Eiji, Honda, Yuki, Saraya, Takuya, Kobayashi, Masaharu, Toshiyoshi, Hiroshi, Hiramotoi,

Year:

2019

File:

PDF, 1.36 MB

2019

4

(Invited) Pixel-Parallel 3-D Integrated CMOS Image Sensors for Next-Generation Video Systems

Goto, Masahide, Honda, Yuki, Watabe, Toshihisa, Hagiwara, Kei, Nanba, Masakazu, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Journal:

ECS Transactions

Year:

2018

Language:

english

File:

PDF, 211 KB

english, 2018

5

[IEEE 2018 IEEE International Symposium on Circuits and Systems (ISCAS) - Florence, Italy (2018.5.27-2018.5.30)] 2018 IEEE International Symposium on Circuits and Systems (ISCAS) - Quarter Video Graphics Array Full-Digital Image Sensing with Wide Dynamic Range and Linear Output Using Pixel-Wise 3D Integration

Goto, Masahide, Honda, Yuki, Watabe, Toshihisa, Hagiwara, Kei, Nanba, Masakazu, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Year:

2018

Language:

english

File:

PDF, 576 KB

english, 2018

6

(Invited) Development of Novel Three-Dimensional Structuring of Integrated Circuits by Using Low Temperature Direct Bonding for CMOS Image Sensors

Goto, M., Hagiwara, K., Iguchi, Y., Ohtake, H., Saraya, T., Higurashi, E., Toshiyoshi, H., Hiramoto, T.

Journal:

ECS Transactions

Year:

2014

Language:

english

File:

PDF, 580 KB

english, 2014

7

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - 3-Layered Au/SiO2 hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors

Honda, Yuki, Goto, Masahide, Watabe, Toshihisa, Hagiwara, Kei, Nanba, Masakazu, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Year:

2017

Language:

english

File:

PDF, 426 KB

english, 2017

8

[IEEE 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Rohnert Park, CA, USA (2015.10.5-2015.10.8)] 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - 128 × 96 Pixel-parallel three-dimensional integrated CMOS image sensors with 16-bit A/D converters: By direct bonding with embedded Au electrodes

Goto, Masahide, Hagiwara, Kei, Honda, Yuki, Nanba, Masakazu, Ohtake, Hiroshi, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Year:

2015

Language:

english

File:

PDF, 1.09 MB

english, 2015

9

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Mechanical grinding of Au/SiO2 hybrid-bonded substrates for 3D integrated image sensors

Hagiwara, Kei, Goto, Masahide, Ohtake, Hiroshi, Iguchi, Yoshinori, Saraya, Takuya, Toshiyoshi, Hiroshi, Higurashi, Eiji, Hiramoto, Toshiro

Year:

2014

Language:

english

File:

PDF, 303 KB

english, 2014

10

Fabrication of Micromechanical Tunneling Probes and Actuators on a Silicon Chip

Toshiyoshi, Hiroshi, Goto, Masahide, Mita, Makoto, Fujita, Hiroyuki, Kobayashi, Dai, Hashiguchi, Gen, Endo, Junji, Wada, Yasuo

Journal:

Japanese Journal of Applied Physics

Year:

1999

Language:

english

File:

PDF, 149 KB

english, 1999

11

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Three-dimensional integration technology of separate SOI layers for photodetectors and signal processors of CMOS image sensors

Goto, Masahide, Hagiwara, Kei, Honda, Yuki, Nanba, Masakazu, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Year:

2016

Language:

english

File:

PDF, 829 KB

english, 2016

12

A novel MOSFET with vertical signal-transfer capability for 3D-structured CMOS image sensors

Goto, Masahide, Hagiwara, Kei, Iguchi, Yoshinori, Ohtake, Hiroshi, Saraya, Takuya, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Journal:

IEEJ Transactions on Electrical and Electronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.43 MB

english, 2014

13

[Japan Society of Applied Physics Digest of Papers. Microprocesses and Nanotechnology '99. 1999 International Microprocesses and Nanotechnology Conference - Yokohama, Japan (6-8 July 1999)] Digest of Papers. Microprocesses and Nanotechnology '99. 1999 International Microprocesses and Nanotechnology Conference - Micromechanical tunneling probes and actuators on a silicon chip

Toshiyoshi, H., Mita, M., Goto, M., Hashiguchi, G., Fujita, P., Kobayashi, D., Endo, J., Wada, Y.

Year:

1999

Language:

english

File:

PDF, 339 KB

english, 1999

14

[IEEE 2014 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2014.12.15-2014.12.17)] 2014 IEEE International Electron Devices Meeting - Three-dimensional integrated CMOS image sensors with pixel-parallel A/D converters fabricated by direct bonding of SOI layers

Goto, Masahide, Hagiwara, Kei, Iguchi, Yoshinori, Ohtake, Hiroshi, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Year:

2014

Language:

english

File:

PDF, 1.83 MB

english, 2014

15

10.2472/jsms.29.506

NISHIBAYASHI, Shinzo, YAMURA, Kiyoshi, INOUE, Shoichi, GOTO, Toshiyoshi

Journal:

Journal of the Society of Materials Science Japan

Year:

1980

Language:

english

File:

PDF, 716 KB

english, 1980

16

[IEEE 2015 IEEE SENSORS - Busan, South Korea (2015.11.1-2015.11.4)] 2015 IEEE SENSORS - Development of a three-dimensional integrated image sensor with pixel-parallel signal processing architecture

Hagiwara, Kei, Goto, Masahide, Honda, Yuki, Nanba, Masakazu, Ohtake, Hiroshi, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Toshiyoshi, Hiroshi, Higurashi, Eiji, Hiramoto, Toshiro

Year:

2015

Language:

english

File:

PDF, 596 KB

english, 2015

17

Quarter Video Graphics Array Digital Pixel Image Sensing With a Linear and Wide-Dynamic-Range Response by Using Pixel-Wise 3-D Integration

Goto, Masahide, Honda, Yuki, Watabe, Toshihisa, Hagiwara, Kei, Nanba, Masakazu, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Journal:

IEEE Transactions on Electron Devices

Year:

2018

Language:

english

File:

PDF, 3.36 MB

english, 2018

18

Pixel-Parallel 3-D Integrated CMOS Image Sensors With Pulse Frequency Modulation A/D Converters Developed by Direct Bonding of SOI Layers

Goto, Masahide, Hagiwara, Kei, Iguchi, Yoshinori, Ohtake, Hiroshi, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, and Toshiro

Journal:

IEEE Transactions on Electron Devices

Year:

2015

Language:

english

File:

PDF, 5.19 MB

english, 2015

19

Au / SiO2 Hybrid Bonding with 6- m-Pitch Au Electrodes for 3D Structured Image Sensors

Honda, Y., Hagiwara, K., Goto, M., Watabe, T., Nanba, M., Iguchi, Y., Saraya, T., Kobayashi, M., Toshiyoshi, H., Higurashi, E., Hiramoto, T.

Journal:

ECS Transactions

Year:

2016

Language:

english

File:

PDF, 523 KB

english, 2016

20

Effects of adding a monosodium glutamate fermented by-product on the fermentation quality of whole crop rice (Oryza sativa L.) silage, digestibility and ruminal fermentation in beef cattle

Jiachen Fang, Masatoshi Matsuzaki, Hiroyuki Suzuki, Yimiti Wusiman, Masakazu Goto, Ken-ichi Horiguchi, Toshiyoshi Takahashi

Journal:

Grassland Science

Year:

2011

Language:

english

File:

PDF, 89 KB

english, 2011

21

[IEEE 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (Formerly known as SOI Conference) - Monterey, CA, USA (2013.10.7-2013.10.10)] 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Three-dimensional integrated circuits with NFET and PFET on separate layers fabricated by low temperature Au/SiO2 hybrid bonding

Goto, M., Hagiwara, K., Iguchi, Y., Ohtake, H., Saraya, T., Higurashi, E., Toshiyoshi, H., Hiramoto, T.

Year:

2013

Language:

english

File:

PDF, 590 KB

english, 2013

22

3-D Silicon-on-Insulator Integrated Circuits With NFET and PFET on Separate Layers Using Au/SiO2 Hybrid Bonding

Goto, Masahide, Hagiwara, Kei, Iguchi, Yoshinori, Ohtake, Hiroshi, Saraya, Takuya, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Journal:

IEEE Transactions on Electron Devices

Year:

2014

Language:

english

File:

PDF, 3.26 MB

english, 2014

23

Scanning the literature

Goto, Masahide, Hagiwara, Kei, Iguchi, Yoshinori, Ohtake, Hiroshi, Saraya, Takuya, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Journal:

IEEE Wireless Communications

Year:

2006

Language:

english

File:

PDF, 759 KB

english, 2006

24

Three-Dimensional Integration of Fully Depleted Silicon-on-Insulator Transistor Substrates for CMOS Image Sensors Using Au/SiO2 Hybrid Bonding and XeF2 Etching

Hagiwara, K., Goto, M., Iguchi, Y., Ohtake, H., Saraya, T., Toshiyoshi, H., Higurashi, E., Hiramoto, T.

Journal:

ECS Transactions

Year:

2014

Language:

english

File:

PDF, 828 KB

english, 2014

25

[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers

Goto, Masahide, Hagiwara, Kei, Iguchi, Yoshinori, Ohtake, Hiroshi, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Year:

2015

Language:

english

File:

PDF, 1.35 MB

english, 2015

26

(Invited) Pixel-Parallel CMOS Image Sensors with 16-Bit A/D Converters Developed by 3-D Integration of SOI Layers with Au/SiO2 Hybrid Bonding

Goto, M., Hagiwara, K., Honda, Y., Nanba, M., Iguchi, Y., Saraya, T., Kobayashi, M., Higurashi, E., Toshiyoshi, H., Hiramoto, T.

Journal:

ECS Transactions

Year:

2016

Language:

english

File:

PDF, 119 KB

english, 2016

27

[IEEE 1999 7th IEEE Conference on Emerging Technologies and Factory Automation. ETFA'99 - Barcelona, Spain (18-21 Oct. 1999)] 1999 7th IEEE International Conference on Emerging Technologies and Factory Automation. Proceedings ETFA '99 (Cat. No.99TH8467) - A micromachined tunneling current device for the direct observation of the tunneling gap

Fujita, H., Hashiguchi, G., Mita, M., Toshiyoshi, H., Kobayashl, D., Goto, M., Wada, Y., Endo, J.

Year:

1999

Language:

english

File:

PDF, 498 KB

english, 1999

28

Triple-Stacked Au/SiO2 Hybrid Bonding with 6-μm-pitch Au Electrodes on Silicon-On-Insulator Substrates using O2 Plasma Surface Activation for Three-Dimensional Integration

Honda, Yuki, Goto, Masahide, Watabe, Toshihisa, Hagiwara, Kei, Nanba, Masakazu, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

File:

PDF, 9 KB

2019

29

Properties of Cement Treated Sludge and Odor Control.

NAKAMURA, Ippei, UEMATSU, Eiji, KAWAMOTO, Fumiyoshi, TSUJINO, Hiroshi, GOTO, Toshiyoshi, SUZUKI, Noriyasu

Journal:

Journal of the Society of Materials Science Japan

Year:

2000

File:

PDF, 873 KB

2000

30

Three-Layered Stacking Process by Au/SiO 2 Hybrid Bonding for 3D Structured Image Sensors

Honda, Yuki, Goto, Masahide, Watabe, Toshihisa, Hagiwara, Kei, Nanba, Masakazu, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Journal:

ECS Transactions

Year:

2017

Language:

english

File:

PDF, 117 KB

english, 2017

31

[IEEE 2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Burlingame, CA, USA (2016.10.10-2016.10.13)] 2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - In-pixel A/D converters with 120-dB dynamic range using event-driven correlated double sampling for stacked SOI image sensors

Goto, Masahide, Honda, Yuki, Watabe, Toshihisa, Hagiwara, Kei, Nanba, Masakazu, Iguch, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, Toshiro

Year:

2016

Language:

english

File:

PDF, 366 KB

english, 2016

32

Development of Novel MOSFET with Front and Back Side Electrodes for 3D-Structured Image Sensors

Goto, M., Hagiwara, K., Iguchi, Y., Ohtake, H., Saraya, T., Toshiyoshi, H., Hiramoto, T.

Journal:

ECS Transactions

Year:

2013

Language:

english

File:

PDF, 935 KB

english, 2013

33

Quantitative Assessment of Pdx1 Promoter Activity in Vivo Using a Secreted Luciferase Reporter System

Nishimura, Wataru, Eto, Koki, Miki, Atsushi, Goto, Motohito, Kawaguchi, Miho, Nammo, Takao, Udagawa, Haruhide, Hiramoto, Masaki, Shimizu, Yukiko, Okamura, Tadashi, Fujiwara, Toshiyoshi, Yasuda, Yoshik

Journal:

Year:

2013

Language:

english

File:

PDF, 1.79 MB

english, 2013

34

EXPERIMENTAL STUDIES ON THE EFFECT OF COMPACTION PROCEDURES ON THE PERFORMANCE OF THE FOUNDATION OF DETACHED HOUSE

FUJII, Mamoru, TAMURA, Masahito, KUROYANAGI, Nobuyuki, IJYUIN, Hiroshi, SUMITOMO, Yoshinori, GOTO, Toshiyoshi

Journal:

Journal of Structural and Construction Engineering (Transactions of AIJ)

Year:

2006

File:

PDF, 1.26 MB

2006

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